Jonathan W. Thibado
11Patents
2h-index
32Co-inventors
46Inventor score
Filing activity: Dec 18, 2014 → Jun 22, 2021
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US10880994B2 | Top-side connector interface for processor packaging | Emerging Cross-Sectional Technologies | 5 | Active |
| US9832876B2 | CPU package substrates with removable memory mechanical interfaces | Emerging Cross-Sectional Technologies | 4 | Active |
| US9603276B2 | Electronic assembly that includes a plurality of electronic packages | Electricity | 1 | Active |
| US12219706B2 | Removable and low insertion force connector system | Electricity | 0 | Active |
| US11683890B2 | Reflow grid array to support late attach of components | Emerging Cross-Sectional Technologies | 0 | Active |
| US11023247B2 | Processor package with optimization based on package connection type | Electricity | 0 | Active |
| US11545408B2 | Reflowable grid array to support grid heating | Electricity | 0 | Active |
| US10211120B2 | Rework grid array interposer with direct power | Electricity | 0 | Active |
| US11621237B2 | Interposer and electronic package | Electricity | 0 | Active |
| US11488839B2 | Reflowable grid array as standby heater for reliability | Electricity | 0 | Active |
| US12082370B2 | System device aggregation in a liquid cooling environment | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.