Method of polyimide diffusion bonding for multijunction solar cells
US10211361B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 27, 2016 |
| Grant date | Feb 19, 2019 |
| Priority date | — |
| Expiry date | Nov 10, 2036 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A method of manufacturing a solar cell comprising providing a first semiconductor substrate with an epitaxial sequence of layers of semiconductor material forming a solar cell deposited over the first semiconductor substrate using an MOCVD reactor; depositing a metal layer on top of the sequence of layers of semiconductor material, the metal layer including a top surface layer composed of gold or silver; providing a polymer film; depositing a first metallic adhesion layer that has a coefficient of thermal expansion substantially different from that of the top surface layer on one surface of the polymer film; depositing a second metal adhesion layer over the first metallic adhesion layer and having a different composition from the first layer and having no chemical elements in common; and adjoining the second adhesion layer of the polymer film to the metal layer of the sequence of layers and permanently bonding it thereto by a thermocompressive diffusion bonding technique.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.