Integrated MEMS system
US10214414B2 · kind B2 · utility
3Cited by
195References
24Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 11, 2016 |
| Grant date | Feb 26, 2019 |
| Priority date | — |
| Expiry date | Jan 11, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/16145
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
An integrated MEMS system having a MEMS chip, including a MEMS transducer, and at least one IC chip, including MEMS processing circuitry, and additional circuitry to process electrical signals. The MEMS chip can include first and second insulated conducting pathways. The first pathways conduct the MEMS-signals between the transducer and the IC chip, for processing; and the second conducting pathways can extend through the entire thickness of the MEMS chip, to conduct electrical signals to the IC chip, to be processed by additional circuitry.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.