Method and apparatus for producing and measuring dynamically focused, steered, and shaped oblique laser illumination for spinning wafer inspection system
US10215712B2 · kind B2 · utility
3Cited by
3References
9Claims
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Key dates
| Filing date | Nov 30, 2014 |
| Grant date | Feb 26, 2019 |
| Priority date | — |
| Expiry date | Oct 1, 2036 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01N2201/0633
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A method and apparatus for producing high frequency dynamically focused oblique laser illumination for a spinning wafer inspection system. The focus is changed by changing the beam direction incidence angle so as to bring focal spot onto the wafer surface.Disclosed herein is a system and method for automatic beam shaping (i.e., spot size) and steering (i.e., position) for a spinning wafer inspection system, combined into a single module. Also disclosed is a method and system for measuring the beam position/size/shape and angle with sufficient resolution to make corrections using feedback from the monitor.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.