Electronic device module and manufacturing method thereof
US10219380B2 · kind B2 · utility
1Cited by
2References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 1, 2015 |
| Grant date | Feb 26, 2019 |
| Priority date | — |
| Expiry date | Nov 22, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/2072
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An electronic device module includes a board including external connecting electrodes and mounting electrodes; an electronic device mounted on the mounting electrodes; a molded portion sealing the electronic device; connection conductors having an end bonded to the external connecting electrodes and penetrating through the molded portion; and external terminals bonded to another end of the connection conductors.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.