Do Jae Yoo
31Patents
5h-index
39Co-inventors
65Inventor score
Filing activity: Jan 23, 2008 → Feb 17, 2023
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US8017437B2 | Method for manufacturing a semiconductor package | Electricity | 41 | Active |
| US7642656B2 | Semiconductor package and method for manufacturing thereof | Electricity | 13 | Active |
| US8736031B2 | Semiconductor package | Electricity | 8 | Active |
| US9496219B2 | Semiconductor package including an antenna formed in a groove within a sealing element | Electricity | 6 | Active |
| USD708578S1 | Terminal pin | General | 5 | Active |
| US7875497B2 | Method of manufacturing a semiconductor package | Electricity | 5 | Active |
| US9245858B2 | Semiconductor device package with integrated antenna for wireless applications | Electricity | 4 | Active |
| US7875983B2 | Semiconductor package | Electricity | 4 | Active |
| US9748179B2 | Package and method of manufacturing the same | Electricity | 4 | Active |
| US9209114B2 | Power module package with a fastening unit including a non-conductive portion | Electricity | 4 | Active |
| US9076660B2 | Power module package | Electricity | 3 | Active |
| US9202798B2 | Power module package and method for manufacturing the same | Electricity | 2 | Active |
| US9633923B2 | Electronic device module and manufacturing method thereof | Emerging Cross-Sectional Technologies | 2 | Active |
| US9030823B2 | Heat dissipation system for power module | Electricity | 2 | Active |
| USD708139S1 | Terminal pin | General | 1 | Active |
| US9585260B2 | Electronic component module and manufacturing method thereof | Electricity | 1 | Active |
| US10163746B2 | Semiconductor package with improved signal stability and method of manufacturing the same | Electricity | 1 | Active |
| US10219380B2 | Electronic device module and manufacturing method thereof | Electricity | 1 | Active |
| US9343391B2 | Semiconductor package and method of manufacturing the same | Electricity | 1 | Active |
| US12262477B2 | Reprint apparatus for circuit board and reprint method using the same | Electricity | 0 | Active |
| US9123683B2 | Unit power module and power module package comprising the same | Electricity | 0 | Active |
| US10667419B2 | Manufacturing method of an electronic component module | Electricity | 0 | Active |
| US10109595B2 | Double-sided package module and substrate strip | Electricity | 0 | Active |
| US11387270B2 | Image sensor package including reflector | Electricity | 0 | Active |
| US9105601B2 | Power module package | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.