Process for manufacturing a printed circuit board having high density microvias formed in a thick substrate
US10219387B2 · kind B2 · utility
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22Claims
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Key dates
| Filing date | Jan 30, 2013 |
| Grant date | Feb 26, 2019 |
| Priority date | — |
| Expiry date | May 25, 2036 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49165
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A process for manufacturing a printed circuit board having high-density microvias formed in a thick substrate is disclosed. The method includes the steps of forming one or more holes in a thick substrate using a laser drilling technique, electroplating the one or more holes with a conductive material, wherein the conductive material does not completely fill the one or more holes, and filling the one or more plated holes with a non-conductive material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.