Ronilo Boja
7Patents
3h-index
10Co-inventors
54Inventor score
Filing activity: Nov 26, 1993 → Aug 23, 2019
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US10438863B1 | Chip package assembly with surface mounted component protection | Electricity | 7 | Active |
| US10764996B1 | Chip package assembly with composite stiffener | Electricity | 4 | Active |
| US8810028B1 | Integrated circuit packaging devices and methods | Electricity | 3 | Active |
| US11201095B1 | Chip package having a cover with window | Electricity | 1 | Active |
| US5381641A | BGA funnel | Performing Operations; Transporting | 1 | Expired |
| US9659815B2 | System, method, and computer program product for a cavity package-on-package structure | Electricity | 0 | Active |
| US10219387B2 | Process for manufacturing a printed circuit board having high density microvias formed in a thick substrate | Emerging Cross-Sectional Technologies | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.