Patent · US Active

Packing of polycrystalline silicon

US10221002B2 · kind B2 · utility

0Cited by

3References

6Claims

0Family size

Assignee

Wacker Chemie AG · DE

Inventors

Joachim Mattes · Burghausen, DE
Bruno Lichtenegger · Emmerting, DE
Matthias VIETZ · Mattighofen, AT

Key dates

Filing date	Apr 12, 2013
Grant date	Mar 5, 2019
Priority date	—
Expiry date	Jun 2, 2036

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10T428/2942
WIPO fieldHandling
WIPO sectorMechanical engineering

Abstract

A method for packing polycrystalline silicon in the form of fragments or round rods, wherein at least one film in each case is inserted into a cuboidal cardboard box matched to the dimensions of the polycrystalline silicon to be packed, the polycrystalline silicon is introduced into the at least one film, the at least one film of thickness 10 to 1000 μm subsequently being welded and enclosing the polycrystalline silicon, and this at least one film being surrounded by a further film having a reinforcing structure or by a shaping element.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.