Bruno Lichtenegger
7Patents
3h-index
10Co-inventors
50Inventor score
Filing activity: Oct 30, 2001 → Jun 26, 2014
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6530826B2 | Process for the surface polishing of silicon wafers | Electricity | 12 | Expired |
| US8833042B2 | Method and device for packaging polycrystalline bulk silicon | Performing Operations; Transporting | 4 | Active |
| US7694568B2 | Method for the nondestructive material testing of highly pure polycrystalline silicon | Physics | 4 | Active |
| US9550607B2 | Packing polycrystalline silicon | Performing Operations; Transporting | 2 | Active |
| US8938936B2 | Method and device for dosing and packaging polysilicon chunks and dosing and packaging unit | Performing Operations; Transporting | 2 | Active |
| US10221002B2 | Packing of polycrystalline silicon | Emerging Cross-Sectional Technologies | 0 | Active |
| US9981796B2 | Packing polycrystalline silicon | Performing Operations; Transporting | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.