Aqueous silica slurry compositions for use in shallow trench isolation and methods of using them

US10221336B2 · kind B2 · utility

Assignee

• Rohm and Haas Electronic Materials CMP Holdings, Inc. · US

Inventors

• Julia Kozhukh · Cambridge, US
• David Mosley · Philadelphia, US
• Naresh Kumar Penta · Newark, US
• Matthew Van Hanehem · Middletown, US
• Kancharla-Arun Kumar Reddy · Wilmington, US

Key dates

• Filing date: Aug 18, 2017
• Grant date: Mar 5, 2019
• Expiry date: Aug 18, 2037

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y02P20/582
• WIPO field: Basic materials chemistry
• WIPO sector: Chemistry

Abstract

The present invention provides aqueous CMP polishing compositions comprising a from 0.5 to 30 wt. %, based on the total weight of the composition of a dispersion of a plurality of elongated, bent or nodular colloidal silica particles which contain a cationic nitrogen atom, and from 0.001 to 0.5 wt. %, preferably from 10 to 500 ppm, of a cationic copolymer of a diallyldimethylammonium salt, such as a diallyldimethylammonium halide, wherein the compositions have a pH of from 1 to 4.5. Preferably, the cationic copolymer of a diallyldimethylammonium salt comprises a copolymer of diallyldimethylammonium chloride (DADMAC) and sulfur dioxide. The slurry compositions demonstrate good oxide selectivity in the CMP polishing of pattern wafers having nitride and silicon patterns.