Centering substrates on a chuck
US10224225B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 19, 2018 |
| Grant date | Mar 5, 2019 |
| Priority date | — |
| Expiry date | Apr 19, 2038 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T279/21
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
An apparatus and an associated method. The apparatus includes a chuck, an array of three or more ultrasonic sensors, a ceramic ring surrounding the chuck, and a controller connected to the ultrasonic sensors. The chuck is configured to removeably hold a substrate for processing. Each ultrasonic sensor may send a respective ultrasonic sound wave to a respective preselected peripheral region of the substrate and receive a respective return ultrasonic sound wave from the preselected peripheral region. The controller may compare a measured position of the substrate on the chuck to a specified placement of the substrate on the chuck based on a measured elapsed time between sending the ultrasonic sound wave and receiving the return ultrasonic sound wave for each ultrasonic sensor. The method compares a measured position of the substrate on the chuck to a specified position on the chuck.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.