Method of curing thermoplastics with microwave energy
US10224258B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Mar 22, 2013 |
| Grant date | Mar 5, 2019 |
| Priority date | — |
| Expiry date | May 12, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method for densifying thermoplastics, particularly polyimides, for use in conjunction with electronic circuits while producing improved physical properties and a high degree of crystallinity, involves variable frequency microwave (VFM) processing at temperatures typically 100° C. below the glass transition temperature or lower, for times of about 50 to 100 minutes. It is particularly applicable to polymers based on BPDA-PPD, but may also be generally applied to other intentionally designed polyimide structures with the same features. The invention enables the creation of layered structures involving integrated circuits with small feature sizes and overcoatings of polymers with high Tg and other desirable properties.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.