Flexible heat spreader lid
US10224262B2 · kind B2 · utility
0Cited by
8References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 12, 2017 |
| Grant date | Mar 5, 2019 |
| Priority date | — |
| Expiry date | May 12, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/15311
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Heat spreader lids and package assemblies including a heat spreader lid. The heat spreader lid has a central region configured to be coupled with an electronic component, a peripheral region configured to be coupled with a substrate, and a connecting region arranged between the central region and the peripheral region. The connecting region is configured to impart stress relief to the central region.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.