Patent · US Active

Apparatus and method for plating and/or polishing wafer

US10227705B2 · kind B2 · utility

0Cited by

1References

21Claims

0Family size

Assignee

ACM RESEARCH (SHANGHAI), INC. · CN

Inventors

Jian Wang · Rosharon, US
Yinuo Jin · Shanghai, CN
Hongchao Yang · Shanghai, CN
Hui Wang · Shanghai, CN

Key dates

Filing date	May 9, 2013
Grant date	Mar 12, 2019
Priority date	—
Expiry date	Aug 29, 2034

Classification

Technology area (CPC C)Chemistry; Metallurgy
CPC primaryC25F7/00
WIPO fieldSurface technology, coating
WIPO sectorChemistry

Abstract

An apparatus and a method for plating and/or polishing wafer includes a wafer chuck, an auxiliary nozzle apparatus and a main nozzle apparatus. The wafer chuck holds and positions the wafer, moves horizontally, and rotates. The auxiliary nozzle apparatus supplies uncharged or charged electrolyte to cover the outer edge of the wafer and the wafer chuck, and the main nozzle apparatus supplies charged electrolyte to the surface of the wafer, to improve the plating and/or polishing uniformity of the outer edge of the wafer, reduce the entire electric resistance of the apparatus, and improve the plating and/or polishing rate.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.