Yinuo Jin
17Patents
2h-index
12Co-inventors
47Inventor score
Filing activity: Mar 28, 2012 → Mar 9, 2023
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US9558985B2 | Vacuum chuck | Emerging Cross-Sectional Technologies | 9 | Active |
| US11141762B2 | System for cleaning semiconductor wafers | Physics | 2 | Active |
| US11257667B2 | Methods and apparatus for cleaning semiconductor wafers | Electricity | 1 | Active |
| US10910244B2 | Methods and system for cleaning semiconductor wafers | Electricity | 1 | Active |
| US11037804B2 | Methods and apparatus for cleaning substrates | Emerging Cross-Sectional Technologies | 1 | Active |
| US11581205B2 | Methods and system for cleaning semiconductor wafers | Electricity | 1 | Active |
| US11781235B2 | Plating apparatus and plating method | Emerging Cross-Sectional Technologies | 0 | Active |
| US11911808B2 | System for cleaning semiconductor wafers | Physics | 0 | Active |
| US9865476B2 | Method and apparatus for pulse electrochemical polishing | Electricity | 0 | Active |
| US11752529B2 | Method for cleaning semiconductor wafers | Physics | 0 | Active |
| US11103898B2 | Methods and apparatus for cleaning substrates | Performing Operations; Transporting | 0 | Active |
| US11633765B2 | System for cleaning semiconductor wafers | Physics | 0 | Active |
| US11967497B2 | Methods and apparatus for cleaning semiconductor wafers | Electricity | 0 | Active |
| US11638937B2 | Methods and apparatus for cleaning substrates | Performing Operations; Transporting | 0 | Active |
| US9724803B2 | Nozzle for stress-free polishing metal layers on semiconductor wafers | Chemistry; Metallurgy | 0 | Active |
| US10227705B2 | Apparatus and method for plating and/or polishing wafer | Chemistry; Metallurgy | 0 | Active |
| US11848217B2 | Methods and apparatus for cleaning substrates | Emerging Cross-Sectional Technologies | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.