Method of making a wire support leadframe for a semiconductor device
US10229868B2 · kind B2 · utility
0Cited by
2References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 14, 2018 |
| Grant date | Mar 12, 2019 |
| Priority date | — |
| Expiry date | Feb 14, 2038 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/17747
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A leadframe includes a plurality of interconnected support members. A pair of die pads is connected to the support members and configured to receive a pair of dies electrically connected by at least one wire. A support bracket extends between the die pads and includes a surface for maintaining the at least one wire at a predetermined distance from the die pads during overmolding of the leadframe.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.