Steven Su
28Patents
7h-index
8Co-inventors
62Inventor score
Filing activity: Mar 14, 1996 → Feb 12, 2020
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| USD381327S | Computer front panel | General | 32 | Expired |
| US7182630B1 | Common lead device for SATA and periphery power connectors | Electricity | 22 | Expired |
| USD396461S | Computer front panel | General | 16 | Expired |
| USD396460S | Computer front panel | General | 9 | Expired |
| US6643126B2 | Automatic temperature display and fan rotary speed adjusting device | Emerging Cross-Sectional Technologies | 8 | Expired |
| US7137015B2 | Switching power supply having cooling fan cooling down system after power turned off | Physics | 7 | Expired |
| US7097556B2 | Power supply capable of dissipating heat from computer unit | Physics | 7 | Expired |
| USD556200S1 | Keyboard | General | 7 | Expired |
| US7177147B2 | Heat dissipation device for computer hard drive | Physics | 6 | Expired |
| US6859027B2 | Device and method for measuring jitter in phase locked loops | Electricity | 5 | Expired |
| US7411783B2 | Computer DC power source output device | Physics | 5 | Expired |
| USD547719S1 | Metallic stand | General | 4 | Expired |
| US7351137B2 | Heat dissipating fan with manual adjustment rotational speed | Emerging Cross-Sectional Technologies | 4 | Expired |
| US9627331B1 | Method of making a wire support leadframe for a semiconductor device | Electricity | 3 | Active |
| US10121733B2 | Wire support for a leadframe | Electricity | 2 | Active |
| US9922908B2 | Semiconductor package having a leadframe with multi-level assembly pads | Electricity | 2 | Active |
| US9337130B2 | Leadframe strip and leadframes | Electricity | 1 | Active |
| US6736608B2 | Heat-dissipating fan with manually adjustable speed-setting | Emerging Cross-Sectional Technologies | 0 | Expired |
| US10529654B2 | Wire support for a leadframe | Electricity | 0 | Active |
| US9786582B2 | Planar leadframe substrate having a downset below within a die area | Electricity | 0 | Active |
| US10211132B2 | Packaged semiconductor device having multi-level leadframes configured as modules | Electricity | 0 | Active |
| US10600724B2 | Leadframe with vertically spaced die attach pads | Electricity | 0 | Active |
| US10811343B2 | Method of making a wire support leadframe for a semiconductor device | Electricity | 0 | Active |
| US9363901B2 | Making a plurality of integrated circuit packages | Electricity | 0 | Active |
| US10229868B2 | Method of making a wire support leadframe for a semiconductor device | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.