Systems and methods for electromagnetic interference shielding
US10229887B2 · kind B2 · utility
1Cited by
0References
6Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 31, 2016 |
| Grant date | Mar 12, 2019 |
| Priority date | — |
| Expiry date | Aug 11, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3511
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Discussed generally herein are methods and devices including or providing an electromagnetic interference (EMI) shielding. A device can include substrate including electrical connection circuitry therein, ground circuitry on, or at least partially in the substrate, the ground circuitry at least partially exposed by a surface of the substrate, a die electrically connected to the connection circuitry and the ground circuitry, the die on the substrate, a conductive material on a die backside, and a conductive paste or one or more wires electrically connected to the ground circuitry and the conductive material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.