Inventor · Phoenix, AZ, US

Mitul Modi

38Patents
2h-index
70Co-inventors
56Inventor score

Filing activity: May 20, 2005 → Dec 28, 2023

Most-cited inventions

PatentTitleAreaCited byStatus
US10199354B2 Die sidewall interconnects for 3D chip assemblies Electricity 149 Active
US7352061B2 Flexible core for enhancement of package interconnect reliability Electricity 3 Expired
US10510667B2 Conductive coating for a microelectronics package Electricity 2 Active
US11328968B2 Stacked die cavity package Electricity 1 Active
US11430724B2 Ultra-thin, hyper-density semiconductor packages Electricity 1 Active
US10224290B2 Electromagnetically shielded electronic devices and related systems and methods Electricity 1 Active
US9516752B2 Underfill device and method Emerging Cross-Sectional Technologies 1 Active
US10229887B2 Systems and methods for electromagnetic interference shielding Electricity 1 Active
US11574851B2 Coupled cooling fins in ultra-small systems Electricity 1 Active
US8399291B2 Underfill device and method Emerging Cross-Sectional Technologies 1 Active
US10910314B2 Conductive coating for a microelectronics package Electricity 0 Active
US10763220B2 Systems and methods for electromagnetic interference shielding Electricity 0 Active
US7633142B2 Flexible core for enhancement of package interconnect reliability Electricity 0 Active
US11417630B2 Semiconductor package having passive support wafer Electricity 0 Active
US12422615B2 Nested glass packaging architecture for hybrid electrical and optical communication devices Electricity 0 Active
US12068222B2 Dummy die structures of a packaged integrated circuit device Electricity 0 Active
US12176268B2 Open cavity bridge co-planar placement architectures and processes Electricity 0 Active
US9704811B1 Perforated conductive material for EMI shielding of semiconductor device and components Electricity 0 Active
US11545407B2 Thermal management solutions for integrated circuit packages Electricity 0 Active
US12406914B2 Ultra-thin, hyper-density semiconductor packages Electricity 0 Active
US7719109B2 Embedded capacitors for reducing package cracking Electricity 0 Active
US7692307B2 Compliant structure for an electronic device, method of manufacturing same, and system containing same Emerging Cross-Sectional Technologies 0 Active
US10325866B2 Electronic device packages with conformal EMI shielding and related methods Electricity 0 Active
US7745917B2 Compliant integrated circuit package substrate Emerging Cross-Sectional Technologies 0 Active
US11705377B2 Stacked die cavity package Electricity 0 Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.