Electronic package and fabrication method thereof
US10230152B2 · kind B2 · utility
2Cited by
5References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 5, 2013 |
| Grant date | Mar 12, 2019 |
| Priority date | — |
| Expiry date | Jun 24, 2035 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49016
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
An electronic package is provided, which includes: a substrate; at least an electronic element disposed on the substrate; an antenna structure disposed on the substrate; and an encapsulant formed on the substrate for encapsulating the electronic element and the antenna structure. Therein, the antenna structure has an extension portion and a plurality of support portions connected to the extension portion for supporting the extension portion over the substrate so as to save the surface area of the substrate, thereby meeting the miniaturization requirement of the electronic package.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.