Folded printed circuit assemblies and related methods
US10231337B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Dec 16, 2015 |
| Grant date | Mar 12, 2019 |
| Priority date | — |
| Expiry date | Sep 3, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/042
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Printed circuit assemblies comprising two or more printed circuit boards stacked and/or folded together and related methods. In some embodiments, a first printed circuit board comprising a first plurality of electrical components may be coupled with a second printed circuit board comprising a second plurality of electrical components using a flexible coupling member. The first printed circuit board may be stacked on top of the second printed circuit board and coupled using an adhesive layer positioned in between the first printed circuit board and the second printed circuit board. The adhesive layer may be configured to maintain the first printed circuit board in a stacked configuration with respect to the second printed circuit board.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.