Methods of forming trenches in packages structures and structures formed thereby
US10231338B2 · kind B2 · utility
1Cited by
27References
23Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 24, 2015 |
| Grant date | Mar 12, 2019 |
| Priority date | — |
| Expiry date | Nov 26, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/041
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
Methods of forming a package structures comprising a trench are described. An embodiment includes a first die disposed on a first substrate, and at least one interconnect structure disposed on a peripheral region of the first substrate. A molding compound is disposed on a portion of the first substrate and on the first die, wherein a trench opening is disposed in the molding compound that is located between the at least one interconnect structure and the first die.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.