Robert M. Nickerson
41Patents
9h-index
67Co-inventors
78Inventor score
Filing activity: Jun 30, 2003 → Dec 28, 2023
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7304373B2 | Power distribution within a folded flex package method and apparatus | Electricity | 75 | Expired |
| US8742597B2 | Package substrates with multiple dice | Electricity | 55 | Active |
| US8987918B2 | Interconnect structures with polymer core | Electricity | 48 | Active |
| US9159690B2 | Tall solders for through-mold interconnect | Electricity | 42 | Active |
| US7358444B2 | Folded substrate with interposer package for integrated circuit devices | Emerging Cross-Sectional Technologies | 17 | Expired |
| US8513792B2 | Package-on-package interconnect stiffener | Electricity | 14 | Active |
| US7375978B2 | Method and apparatus for trace shielding and routing on a substrate | Electricity | 12 | Expired |
| US7190068B2 | Bottom heat spreader | Electricity | 12 | Expired |
| US9666549B2 | Methods for solder for through-mold interconnect | Electricity | 10 | Active |
| US10121722B1 | Architecture material and process to improve thermal performance of the embedded die package | Electricity | 9 | Active |
| US7250684B2 | Circular wire-bond pad, package made therewith, and method of assembling same | Emerging Cross-Sectional Technologies | 7 | Expired |
| US6794760B1 | Integrated circuit interconnect | Electricity | 6 | Expired |
| US10446530B2 | Offset interposers for large-bottom packages and large-die package-on-package structures | Emerging Cross-Sectional Technologies | 4 | Active |
| US9691728B2 | BBUL top side substrate layer enabling dual sided silicon interconnect and stacking flexibility | Electricity | 3 | Active |
| US10607976B2 | Offset interposers for large-bottom packages and large-die package-on-package structures | Emerging Cross-Sectional Technologies | 3 | Active |
| US11430724B2 | Ultra-thin, hyper-density semiconductor packages | Electricity | 1 | Active |
| US10231338B2 | Methods of forming trenches in packages structures and structures formed thereby | Electricity | 1 | Active |
| US7302756B2 | Bond finger on via substrate, process of making same, package made thereby, and method of assembling same | Emerging Cross-Sectional Technologies | 1 | Expired |
| US12347743B2 | Microelectronics package comprising a package-on-package (PoP) architecture with inkjet barrier material for controlling bondline thickness and pop adhesive keep out zone | Electricity | 0 | Active |
| US11222877B2 | Thermally coupled package-on-package semiconductor packages | Electricity | 0 | Active |
| US11798932B2 | Offset interposers for large-bottom packages and large-die package-on-package structures | Emerging Cross-Sectional Technologies | 0 | Active |
| US11056466B2 | Package on package thermal transfer systems and methods | Electricity | 0 | Active |
| US8674519B2 | Microelectronic package and method of manufacturing same | Electricity | 0 | Active |
| US11462527B2 | Micro-trenching mold interface in a pop package | Electricity | 0 | Active |
| US9049807B2 | Processes of making pad-less interconnect for electrical coreless substrate | Emerging Cross-Sectional Technologies | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.