Method for dividing a composite into semiconductor chips, and semiconductor chip
US10232471B2 · kind B2 · utility
0Cited by
3References
12Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Dec 18, 2017 |
| Grant date | Mar 19, 2019 |
| Priority date | — |
| Expiry date | Dec 18, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2221/68327
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
The invention relates to a method for dividing a composite into a plurality of semiconductor chips along a dividing pattern. A composite, which comprises a substrate, a semiconductor layer sequence, and a functional layer, is provided. Separating trenches are formed in the substrate along the dividing pattern. The functional layer is cut through along the dividing pattern by means of coherent radiation. Each divided semiconductor chip has part of the semiconductor layer sequence, part of the substrate, and part of the functional layer. The invention further relates to a semiconductor chip.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.