System and method for measuring substrate and film thickness distribution
US10236222B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 14, 2017 |
| Grant date | Mar 19, 2019 |
| Priority date | — |
| Expiry date | Jun 14, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67288
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
The system includes a dual interferometer sub-system configured to measure flatness across a substrate. The system includes a mass sensor configured to measure the mass of the substrate. The system includes a controller communicatively coupled to the dual interferometer sub-system and the mass sensor. The controller includes one or more processors. The one or more processors are configured to execute a set of program instructions stored in memory, the set of program instructions configured to cause the one or more processors to determine a thickness distribution of at least one of the substrate or a film deposited on the substrate as a function of position across the substrate based on one or more flatness measurements from the dual interferometer sub-system and one or more mass measurements from the mass sensor.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.