Andrew Zeng
13Patents
5h-index
20Co-inventors
66Inventor score
Filing activity: May 4, 2000 → Sep 26, 2019
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6538730B2 | Defect detection system | Physics | 74 | Expired |
| US6862096B2 | Defect detection system | Physics | 14 | Expired |
| US6590645B1 | System and methods for classifying anomalies of sample surfaces | Electricity | 12 | Expired |
| US9121684B2 | Method for reducing wafer shape and thickness measurement errors resulted from cavity shape changes | Physics | 12 | Active |
| US7038772B2 | System and methods for classifying anomalies of sample surfaces | Electricity | 7 | Expired |
| US7016031B2 | System and methods for classifying anomalies of sample surfaces | Electricity | 5 | Expired |
| US8630479B2 | Methods and systems for improved localized feature quantification in surface metrology tools | Physics | 2 | Active |
| US7315365B2 | System and methods for classifying anomalies of sample surfaces | Electricity | 2 | Expired |
| US10571248B2 | Transparent film error correction pattern in wafer geometry system | Physics | 1 | Active |
| US10705026B2 | Scanning differential interference contrast in an imaging system design | Physics | 1 | Active |
| US9279663B2 | Method and apparatus to fold optics in tools for measuring shape and/or thickness of a large and thin substrate | Physics | 0 | Active |
| US11017520B2 | Multi-wavelength interferometry for defect classification | Physics | 0 | Active |
| US10236222B2 | System and method for measuring substrate and film thickness distribution | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.