Polishing pad and polishing method
US10239182B2 · kind B2 · utility
1Cited by
1References
15Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 1, 2017 |
| Grant date | Mar 26, 2019 |
| Priority date | — |
| Expiry date | Jun 13, 2037 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B49/12
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A polishing pad is provided. The polishing pad includes a polishing layer and a detection window. The detection window is disposed in the polishing layer. The modulus of the detection window is larger than the modulus of the polishing layer at 30° C., and the modulus of the detection window is smaller than the modulus of the polishing layer at 50° C.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.