Degradable and recyclable epoxy conductive adhesive as well as preparing, degrading and recycling methods therefor
US10240074B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 27, 2015 |
| Grant date | Mar 26, 2019 |
| Priority date | — |
| Expiry date | May 27, 2035 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC01B13/00
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
The present invention provides a degradable and recyclable epoxy conductive adhesive, which comprises the following raw materials in percentage by weight: 15% to 30% of epoxy resin, 1% to 10% of a curing agent, 0.1% to 2% of a reaction diluent and 15% to 85% of a conductive filler, wherein the curing agent comprises a breakable molecular structure. According to the epoxy conductive adhesive of the present invention, after the epoxy resin in the conductive adhesive is cured by using the recyclable and degradable epoxy resin curing agent of a specific molecular structure, the conductive adhesive can be degraded in normal pressure, mild and specific conditions, the process is simple and the operation is convenient, no contamination is brought to the environment, the recycling cost is largely reduced, and the recycling of the conductive adhesive has enormous economic and environmental advantages. By using the recyclable and degradable epoxy resin curing agent of a specific molecular structure, the shear strength of the conductive adhesive is greatly increased, and the reliability and the service life of the conductive adhesive are largely improved.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.