Patent · US Active

Free access floor structure, and manufacturing apparatus and carrier apparatus adapted for floor structure

US10240350B2 · kind B2 · utility

0Cited by
14References
8Claims
0Family size

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Key dates

Filing dateDec 2, 2014
Grant dateMar 26, 2019
Priority date
Expiry dateFeb 24, 2035

Classification

  • Technology area (CPC E)Fixed Constructions
  • CPC primaryE04F2290/02
  • WIPO fieldTransport
  • WIPO sectorMechanical engineering

Abstract

A free access floor structure to install a manufacturing apparatus such as a semiconductor manufacturing apparatus, in a short time, and a manufacturing apparatus and a carrier apparatus adapted for the floor structure. An embodiment of the manufacturing apparatus includes an apparatus-side connector which is provided, facing downward, to a bottom plate of a manufacturing apparatus. A floor structure of an embodiment includes a floor plate to be worked into a floor surface. The floor structure includes a floor-side connector which is provided, facing upward, to the floor plate so as to be connected with the apparatus-side connector according to a lowering operation of the manufacturing apparatus. An installation step (mounting step, piping/wiring step) of the manufacturing apparatus may thereby be performed in one step. As a result, the labor and the time required to install the manufacturing apparatus may be saved.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.