Substrate liquid processing method and substrate liquid processing apparatus
US10242889B2 · kind B2 · utility
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8Claims
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Key dates
| Filing date | Aug 18, 2015 |
| Grant date | Mar 26, 2019 |
| Priority date | — |
| Expiry date | Aug 18, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/6708
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Disclosed is a substrate liquid processing method. The method includes producing a processing liquid including deionized water, carbon dioxide, and ammonia, which has a PH of a predetermined value in a range of pH 5 to 9; and processing a substrate having a metal exposed, using the processing liquid.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.