Optoelectronic device subassemblies and methods of manufacturing the same
US10243111B2 · kind B2 · utility
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3References
20Claims
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Key dates
| Filing date | Jun 23, 2017 |
| Grant date | Mar 26, 2019 |
| Priority date | — |
| Expiry date | Jun 23, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/0364
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present disclosure describes wafer-level processes for fabricating optoelectronic device subassemblies that can be mounted, for example, to a circuit substrate, such as a flexible cable or printed circuit board, and integrated into optoelectronic modules that include one or more optical subassemblies stacked over the optoelectronic device subassembly. The optoelectronic device subassembly can be mounted onto the circuit substrate using solder reflow technology even if the optical subassemblies are composed of materials that are not reflow compatible.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.