Xu Yi
22Patents
6h-index
35Co-inventors
69Inventor score
Filing activity: Jan 24, 2000 → Feb 14, 2019
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6424044B1 | Use of boron carbide as an etch-stop and barrier layer for copper dual damascene metallization | Electricity | 68 | Expired |
| US6232217A | Post treatment of via opening by N-containing plasma or H-containing plasma for elimination of fluorine species in the FSG near the surfaces of the via opening | Electricity | 32 | Expired |
| US6261942A | Dual metal-oxide layer as air bridge | Electricity | 25 | Expired |
| US6340608B1 | Method of fabricating copper metal bumps for flip-chip or chip-on-board IC bonding on terminating copper pads | Electricity | 14 | Expired |
| US6375857B1 | Method to form fuse using polymeric films | Electricity | 8 | Expired |
| US6429129B1 | Method of using silicon rich carbide as a barrier material for fluorinated materials | Emerging Cross-Sectional Technologies | 7 | Expired |
| US9094593B2 | Optoelectronic modules that have shielding to reduce light leakage or stray light, and fabrication methods for such modules | Emerging Cross-Sectional Technologies | 6 | Active |
| US6365508B1 | Process without post-etch cleaning-converting polymer and by-products into an inert layer | Electricity | 5 | Expired |
| US6540841B1 | Method and apparatus for removing contaminants from the perimeter of a semiconductor substrate | Performing Operations; Transporting | 3 | Expired |
| US6358821B1 | Method of copper transport prevention by a sputtered gettering layer on backside of wafer | Electricity | 3 | Expired |
| US9543354B2 | Optoelectronic modules that have shielding to reduce light leakage or stray light, and fabrication methods for such modules | Electricity | 2 | Active |
| US6730591B2 | Method of using silicon rich carbide as a barrier material for fluorinated materials | Emerging Cross-Sectional Technologies | 2 | Expired |
| US6813796B2 | Apparatus and methods to clean copper contamination on wafer edge | Performing Operations; Transporting | 1 | Expired |
| US10186540B2 | Optoelectronic modules that have shielding to reduce light leakage or stray light | Emerging Cross-Sectional Technologies | 1 | Active |
| US10243111B2 | Optoelectronic device subassemblies and methods of manufacturing the same | Electricity | 0 | Active |
| US9859327B2 | Optoelectronic modules that have shielding to reduce light leakage or stray light, and fabrication methods for such modules | Electricity | 0 | Active |
| US11980548B2 | Carbon fiber composite artificial bone and preparation method thereof | Textiles; Paper | 0 | Active |
| US7060613B2 | Method of copper/copper surface bonding using a conducting polymer for application in IC chip bonding | Electricity | 0 | Expired |
| US10269645B2 | Fin field-effect transistor and fabrication method thereof | Electricity | 0 | Active |
| US11597082B2 | Dispatching method and device, and non-transitory readable storage medium | Emerging Cross-Sectional Technologies | 0 | Active |
| US10510932B2 | Optoelectronic modules including optoelectronic device subassemblies and methods of manufacturing the same | Electricity | 0 | Active |
| US10199426B2 | Optoelectronic modules that have shielding to reduce light leakage or stray light, and fabrication methods for such modules | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.