Semiconductor device, mechanical quantity measuring device, and semiconductor device fabricating method
US10247630B2 · kind B2 · utility
0Cited by
3References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 30, 2016 |
| Grant date | Apr 2, 2019 |
| Priority date | — |
| Expiry date | Jun 30, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/8389
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A semiconductor device includes a metal body; a bonding layer placed on the metal body; and a semiconductor chip placed on the bonding layer. The bonding layer includes a filler-containing first layer formed between the metal body and the semiconductor chip and a second layer bonded to the first layer and the semiconductor chip. The second layer has a thermal expansion coefficient higher than that of the first layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.