Shosaku Ishihara
10Patents
3h-index
32Co-inventors
60Inventor score
Filing activity: Aug 14, 1984 → Jun 30, 2016
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6798059B1 | Multilayer electronic part, its manufacturing method, two-dimensionally arrayed element packaging structure, and its manufacturing method | Electricity | 7 | Expired |
| US4604496A | Ceramic multilayer wiring board | Electricity | 6 | Expired |
| US7498671B2 | Power semiconductor module | Electricity | 3 | Active |
| US7193319B2 | Semiconductor device | Electricity | 3 | Expired |
| US6248960A | Ceramics substrate with electronic circuit and its manufacturing method | Emerging Cross-Sectional Technologies | 2 | Expired |
| US7423349B2 | Semiconductor device | Emerging Cross-Sectional Technologies | 1 | Active |
| US6658733B2 | Method of manufacturing via interconnection of glass-ceramic wiring board | Emerging Cross-Sectional Technologies | 1 | Expired |
| US6384347B1 | Glass-ceramic wiring board | Emerging Cross-Sectional Technologies | 1 | Expired |
| US7719100B2 | Power semiconductor module with MOS chip | Electricity | 1 | Active |
| US10247630B2 | Semiconductor device, mechanical quantity measuring device, and semiconductor device fabricating method | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.