Dynamic leveling process heater lift
US10249525B2 · kind B2 · utility
5Cited by
1References
21Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 14, 2017 |
| Grant date | Apr 2, 2019 |
| Priority date | — |
| Expiry date | Sep 25, 2037 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG05B2219/45031
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method and apparatus for of improving processing results in a processing chamber by orienting a substrate support relative to a surface within the processing chamber. The method comprising orienting a supporting surface of a substrate support in a first orientation relative to an output surface of a showerhead, where the first orientation of the supporting surface relative to the output surface is not coplanar, and depositing a first layer of material on a substrate disposed on the supporting surface that is oriented in the first orientation.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.