Patent · US Active

Package for MEMS device and process

US10252906B2 · kind B2 · utility

1Cited by

0References

20Claims

0Family size

Assignee

CIRRUS LOGIC, INC. · US

Inventors

Roberto Brioschi · Austin, US
David Patten · Austin, US
Rkia Achehboune · Edinburgh, GB

Key dates

Filing date	Oct 19, 2017
Grant date	Apr 9, 2019
Priority date	—
Expiry date	Oct 19, 2037

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/15151
WIPO fieldMicro-structural and nano-technology
WIPO sectorChemistry

Abstract

The application describes a package design for a MEMS transducer having an integrated circuit mounted within a chamber of the package. The integrated circuit may extend into a side wall recess of the package.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.