Semiconductor device and lead frame therefor
US10256168B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 12, 2016 |
| Grant date | Apr 9, 2019 |
| Priority date | — |
| Expiry date | Dec 7, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/18161
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device includes a semiconductor die having a first side having a first terminal and an opposite second side having at least two second terminals. A lead frame has a first part and a second part. The second part of the lead frame is both electrically and mechanically spaced from the first part. The second side of the die is attached to the lead frame such that the first and second lead frame parts are respectively connected to the at least two second terminals. The first and second lead frame parts include respective first and second extensions that project past a side of the die and provide first and second terminal surfaces that are co-planar with the first terminal on the first side of the die. The device makes use of the terminals on the both sides of the die. The device second side is exposed for thermal performance.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.