Chi Ho Leung
12Patents
5h-index
23Co-inventors
58Inventor score
Filing activity: Jan 15, 2014 → Dec 17, 2018
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US9443791B2 | Leadless semiconductor package and method | Electricity | 6 | Active |
| US10410941B2 | Wafer level semiconductor device with wettable flanks | Electricity | 6 | Active |
| US9391007B1 | Built-up lead frame QFN and DFN packages and method of making thereof | Electricity | 6 | Active |
| US9640463B2 | Built-up lead frame package and method of making thereof | Electricity | 6 | Active |
| US9425130B2 | Package with multiple I/O side-solderable terminals | Electricity | 6 | Active |
| US10304759B2 | Electronic device and method of making same | Electricity | 2 | Active |
| US10658274B2 | Electronic device | Electricity | 0 | Active |
| US10256168B2 | Semiconductor device and lead frame therefor | Electricity | 0 | Active |
| US9634739B2 | Wireless communication system and method thereof | Electricity | 0 | Active |
| US10529644B2 | Semiconductor device | Electricity | 0 | Active |
| US10262926B2 | Reversible semiconductor die | Electricity | 0 | Active |
| US9947632B2 | Semiconductor device and method of making a semiconductor device | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.