Vertical and horizontal circuit assemblies

US10256178B2 · kind B2 · utility

Assignee

• FAIRCHILD SEMICONDUCTOR CORPORATION · US

Inventors

• Jerome Teysseyre · Scottsdale, US
• Romel N. Manatad · Balamban, PH
• Chung-Lin Wu · Hsinchu, TW
• Bigildis Dosdos · San Jose, US
• Erwin Ian V. Almagro · Dumaguete, PH
• Maria Cristina Estacio · Davao City, PH

Key dates

• Filing date: Aug 31, 2017
• Grant date: Apr 9, 2019
• Expiry date: Sep 9, 2037

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2224/48247
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

In a general aspect, an apparatus can include a leadframe including a plurality of leads configured to be coupled with a printed circuit board. The plurality of leads can be disposed along a single edge of the apparatus. The apparatus can also include an assembly including a substrate and a plurality of semiconductor die disposed on the substrate. The assembly can being mounted on the leadframe. The apparatus can further include an inductor having a first terminal and a second terminal. The first terminal of the inductor can being coupled with the leadframe via a first contact pad, and the second terminal of the inductor can be coupled with the leadframe via a second contact pad. The leadframe, the assembly and the inductor can be arranged in a stacked configuration.