Inventor · Scottsdale, AZ, US

Jerome Teysseyre

49Patents
4h-index
34Co-inventors
63Inventor score

Filing activity: Feb 20, 2003 → Apr 9, 2025

Most-cited inventions

PatentTitleAreaCited byStatus
US8664044B2 Method of fabricating land grid array semiconductor package Emerging Cross-Sectional Technologies 275 Active
US7005322B2 Process for encapsulating semiconductor components using through-holes in the semiconductor components support substrates Electricity 6 Expired
US11075137B2 High power module package structures Electricity 4 Active
US8860207B2 Method of fabricating land grid array semiconductor package Emerging Cross-Sectional Technologies 4 Active
US7358598B2 Process for fabricating a semiconductor package and semiconductor package with leadframe Electricity 2 Expired
US9059058B2 Image sensor device with IR filter and related methods Electricity 1 Active
US10665525B2 Heat transfer for power modules Electricity 1 Active
US10429509B2 Molded proximity sensor Electricity 1 Active
US10319670B2 Package including multiple semiconductor devices Electricity 1 Active
US11984424B2 Semiconductor packages using package in package systems and related methods Electricity 1 Active
US11222832B2 Power semiconductor device package Electricity 1 Active
US11430777B2 Power module package for direct cooling multiple power modules Electricity 1 Active
US11145571B2 Heat transfer for power modules Electricity 1 Active
US11513220B2 Molded proximity sensor Electricity 0 Active
US6885088B2 Flat leadframe for a semiconductor package Electricity 0 Expired
US11231386B2 Compact microelectronic integrated gas sensor Electricity 0 Active
US12266590B2 Dual side direct cooling semiconductor package Electricity 0 Active
US11988743B2 Molded proximity sensor Electricity 0 Active
US10910297B2 Package including multiple semiconductor devices Electricity 0 Active
US11810775B2 High power module package structures Electricity 0 Active
US11264311B2 Clips for semiconductor package and related methods Electricity 0 Active
US11616006B2 Semiconductor package with heatsink Electricity 0 Active
US11908826B2 Flexible clip with aligner structure Electricity 0 Active
US11735508B2 Vertical and horizontal circuit assemblies Electricity 0 Active
US11545421B2 Package including multiple semiconductor devices Electricity 0 Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.