Substrate-free interconnected electronic mechanical structural systems
US10257951B2 · kind B2 · utility
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20Claims
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Key dates
| Filing date | Dec 27, 2017 |
| Grant date | Apr 9, 2019 |
| Priority date | — |
| Expiry date | Dec 27, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/026
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Substrate-free mechanical structural systems comprised of interconnected subsystems of electronic and/or electromechanical components.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.