Will Stacy
6Patents
3h-index
7Co-inventors
39Inventor score
Filing activity: Mar 14, 2014 → Jan 3, 2018
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US9306254B1 | Substrate-free mechanical interconnection of electronic sub-systems using a spring configuration | Electricity | 25 | Active |
| US9888600B2 | Substrate-free interconnected electronic mechanical structural systems | Electricity | 13 | Active |
| US9306255B1 | Microstructure including microstructural waveguide elements and/or IC chips that are mechanically interconnected to each other | Electricity | 3 | Active |
| US10193203B2 | Structures and methods for interconnects and associated alignment and assembly mechanisms for and between chips, components, and 3D systems | Electricity | 2 | Active |
| US10257951B2 | Substrate-free interconnected electronic mechanical structural systems | Electricity | 0 | Active |
| US10361471B2 | Structures and methods for interconnects and associated alignment and assembly mechanisms for and between chips, components, and 3D systems | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.