Film formation apparatus and film formation method
US10260145B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Mar 17, 2017 |
| Grant date | Apr 16, 2019 |
| Priority date | — |
| Expiry date | Apr 18, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J37/3476
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A film formation apparatus includes a chamber that is a sealed container in which a target formed of a film formation material is placed, and into which the workpiece is carried, a gas discharging unit discharging a gas in the sealed container for a predetermined time period after the workpiece is carried into the chamber to obtain a base pressure, and a sputter gas introducing unit introducing a sputter gas containing oxygen to the interior of the chamber having undergone the discharging and becoming the base pressure. The sputter gas introducing unit decreases an oxygen partial pressure in the sputter gas to be introduced in the chamber in accordance with an increase in the base pressure due to an increase of the film formation material sticking to the interior of the chamber.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.