Method and system for weak pattern quantification
US10262831B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 10, 2017 |
| Grant date | Apr 16, 2019 |
| Priority date | — |
| Expiry date | Oct 10, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J2237/2817
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A weak pattern identification method includes acquiring inspection data from a set of patterns on a wafer, identifying failing pattern types on the wafer, and grouping like pattern types of the failing pattern types into a set of pattern groups. The weak pattern identification method also includes acquiring image data from multiple varied instances of a first pattern type grouped in a first group, wherein the multiple varied instances of the first pattern type are formed under different conditions. The weak pattern identification method also includes comparing images obtained from common structures of the instances of the first pattern type to identify local differences within a portion of the first pattern type. Further, the weak pattern identification method includes identifying metrology sites within the portion of the first pattern type proximate to a location of the local differences within the portion of the first pattern type.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.