Three plate MIM capacitor via integrity verification
US10262934B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 1, 2017 |
| Grant date | Apr 16, 2019 |
| Priority date | — |
| Expiry date | Nov 1, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D1/68
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A three plate MIM capacitor structure includes a three plate MIM capacitor, a first wire in a metal layer above/below the three plate MIM, a second wire below/above the three plate MIM, a third wire below/above the three plate MIM, a first via connected to the first test wire, a second via connected to a middle plate of the three plate MIM, and a third via connected to the top and bottom plates of the three plate MIM. The test structure may verify the integrity the MIM capacitor by applying a potential to the first test wire, applying ground potential to both the second test wire and the third test wire, and detecting leakage current across the first wire and the second and third wires or detecting leakage current across the second wire and the third wire.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.