Patent · US Active

Millimeter wave integrated circuit with ball grid array package including transmit and receive channels

US10262957B2 · kind B2 · utility

0Cited by

6References

19Claims

0Family size

Assignee

TEXAS INSTRUMENTS INCORPORATED · US

Inventors

Rajen Manicon Murugan · Garland, US
Minhong Mi · Dorpsstraat, US
Gary P. Morrison · Garland, US
Jie Chen · New Taipei, TW
Kenneth Robert Rhyner · Rockwall, US
Stanley Craig Beddingfield · McKinney, US
Chittranjan Mohan Gupta · Richardson, US
Django Trombley · Dallas, US

Key dates

Filing date	Apr 10, 2018
Grant date	Apr 16, 2019
Priority date	—
Expiry date	Apr 10, 2038

Classification

Technology area (CPC H)Electricity
CPC primaryH05K2201/10734
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

An integrated circuit (IC) package includes an IC die and a wave channel that electrically couples the IC die to a solder ball array. The wave channel is configured to resonate at an operating frequency band of the IC die.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.