Gary P. Morrison
10Patents
4h-index
14Co-inventors
53Inventor score
Filing activity: Jul 1, 2003 → Apr 10, 2018
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US8178976B2 | IC device having low resistance TSV comprising ground connection | Electricity | 12 | Active |
| US8154134B2 | Packaged electronic devices with face-up die having TSV connection to leads and die pad | Electricity | 10 | Active |
| US6762498B1 | Ball grid array package for high speed devices | Electricity | 8 | Expired |
| US7790597B2 | Solder cap application process on copper bump using solder powder film | Electricity | 5 | Active |
| US7462783B2 | Semiconductor package having a grid array of pin-attached balls | Emerging Cross-Sectional Technologies | 4 | Expired |
| US8431481B2 | IC device having low resistance TSV comprising ground connection | Electricity | 1 | Active |
| US9666553B2 | Millimeter wave integrated circuit with ball grid array package including transmit and receive channels | Electricity | 1 | Active |
| US8436475B2 | IC device having low resistance TSV comprising ground connection | Electricity | 0 | Active |
| US9941228B2 | Millimeter wave integrated circuit with ball grid array package including transmit and receive channels | Electricity | 0 | Active |
| US10262957B2 | Millimeter wave integrated circuit with ball grid array package including transmit and receive channels | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.