Active matrix substrate and method for producing the same
US10263016B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 26, 2017 |
| Grant date | Apr 16, 2019 |
| Priority date | — |
| Expiry date | Jan 26, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/02565
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An active matrix substrate includes a first TFT (10), a second TFT (20) disposed per pixel, and a circuit including the first TFT. The first and second TFTs each include a gate electrode (102A, 102B), a gate insulating layer (103), an oxide semiconductor layer (104A, 104B), and source and drain electrodes in contact with an upper surface of the oxide semiconductor layer. The oxide semiconductor layer (104A, 104B) has a stacked structure including a first semiconductor layer (104e, 104c) in contact with the source and drain electrodes and a second semiconductor layer that is disposed on a substrate-side of the first semiconductor layer and that has a smaller energy gap than the first semiconductor layer. The oxide semiconductor layers (104A) and (104B) are different from each other in terms of the composition and/or the number of stacked layers. The first TFT has a larger threshold voltage than the second TFT.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.