Bumped resonator structure
US10263170B1 · kind B1 · utility
15Cited by
12References
25Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 30, 2017 |
| Grant date | Apr 16, 2019 |
| Priority date | — |
| Expiry date | Nov 30, 2037 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/73207
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A technique relates a structure. An inductive element is on a first surface. A capacitive element is on the first surface and a second surface. An interconnect structure is between the first surface and the second surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.